CES 2026: Intel launch event for Intel Core Ultra Series 3 Processors

Key Concepts

• 18A Process Node: Intel’s advanced semiconductor manufacturing process featuring RibbonFET and PowerVia technologies, delivering significant performance and efficiency gains.
• RibbonFET: Gate-all-around transistor technology for improved current control and efficiency.
• PowerVia: Backside power delivery system enhancing power flow and signal integrity.
• Core Ultra Series 3: Intel’s latest processor family built on the 18A process, featuring enhanced CPU, GPU, and NPU capabilities.
• AIPC (AI PC): Personal computers optimized for AI workloads, leveraging dedicated AI processing units (NPUs).
• Hybrid Core Architecture: Combining Performance-cores (P-cores) and Efficient-cores (E-cores) for optimized performance and power efficiency.
• XMX AI Accelerators: Intel’s AI acceleration technology integrated into the GPU.
• ARC Graphics (B390): Intel’s next-generation integrated GPU architecture with significant performance improvements and AI capabilities.
• XeSS (Xe Super Sampling): Intel’s AI-based upscaling technology for improved gaming performance.
• OpenVINO: Intel’s open-source toolkit for optimizing and deploying AI inference workloads.
• Hybrid AI: A computing model that distributes AI workloads between local devices and the cloud.

Advancements in Intel’s Computing Platform & AI Integration

Intel is experiencing a “strategic inflection point” driven by the rapid evolution of AI and is focused on making intelligence accessible, efficient, and ubiquitous. The company has successfully delivered on its commitment to ship 18A products by the end of 2025, and is currently ramping production of the Core Ultra Series 3 die package. This announcement represents the next evolution of the PC, designed for an AI-driven future.

18A Process Technology & Manufacturing Leadership

A core element of Intel’s strategy is its leadership in manufacturing technology. The 18A process node, featuring RibbonFET and PowerVia technologies, is now in production with Panther Lake. RibbonFET, a gate-all-around transistor technology, provides precise control of electrical current, while PowerVia enhances power flow and signal delivery. These innovations result in up to 15% better performance per watt and over 30% better chip density. Intel’s multi-generational effort to drive power-efficient performance, hybrid core architectures, and multi-engine local AI are all coming to fruition with the 18A process. The company has invested heavily in capital, R&D, and new fabs to expand manufacturing capacity globally.

Core Ultra Series 3: A New Class of Computing

The Core Ultra Series 3 processor, built on the 18A process, represents a significant leap forward in computing performance and efficiency. Key features include:

• Enhanced Cores: New E-cores and redesigned P-cores.
• Advanced GPU: A massive GPU with built-in ray tracing.
• Powerful NPU: A denser NPU for low-power AI inference.
• Next-Gen I/O & Memory: Next-generation memory and I/O connectivity.

Intel leveraged the power efficiency of Lunar Lake as the architectural foundation for Series 3. The GPU tile has been moved to its own chiplet, allowing for scalability based on market segment needs. The redesign of cores for 18A enables operation at significantly lower voltages, increasing per-core performance and efficiency. The addition of up to eight E-cores and a redesigned low-power island with dedicated E-cores further enhances performance and battery life, particularly for workloads like web browsing and video conferencing. All IOs have been consolidated onto a single chip to provide design flexibility for customers.

Graphics Performance with Intel ARC B390

Intel’s ARC graphics have undergone a significant transformation, with the new B390 GPU (12XE) delivering substantial performance improvements. Key highlights include:

• 50% more graphics scores.
• Twice the cache.
• 96 built-in XMX AI accelerators for 120 GPU TOPS.
• 70% higher frame rates compared to the latest AMD Radeon GPUs with similar power and memory.
• Day-one support for AI-based multiframe generation, delivering three AI frames for every rendered frame.

Intel has invested heavily in software development, engaging with 300 developers and releasing 50 day-zero driver updates in the past year. Collaboration with EA on Battlefield 6 demonstrates the potential of Intel ARC graphics, achieving over 120 frames per second with demanding visuals and AI upscaling. Intel is also launching a handheld gaming platform powered by Panther Lake.

AI Integration & the Hybrid AI Era

Intel is at the forefront of integrating AI into its platforms, recognizing its transformative potential across all industries. The company has shipped over four zeta ops (four billion TOPS) of inference compute to the edge, equivalent to 40 data centers worth of compute. Key initiatives include:

• Largest AIPC Footprint: Intel has established the largest AIPC platform in the industry, driving investment from software partners.
• OpenVINO Toolkit: Providing developers with tools to optimize and deploy AI inference workloads.
• Support for Major Frameworks: Supporting Llama CCP, PyTorch, and Windows ML.
• Hybrid AI Approach: Distributing AI workloads between local devices and the cloud for improved security, privacy, performance, and cost.
• Intel AI Superbuilder Platform: Facilitating seamless integration of cloud and local AI models.

Intel is collaborating with partners like Perplexity to advance the hybrid AI model, enabling local processing for security and privacy while leveraging the cloud for complex reasoning and orchestration. The Core Ultra Series 3 processors deliver up to 180 total platform TOPS, with 120 on the GPU and 50 on the NPU, capable of handling a 70 billion parameter model in a 32K context.

Edge Computing Advancements

Intel is extending its AI capabilities to the edge, with Series 3 processors designed for demanding edge applications. Key benefits include:

• Improved LM Latency: Nearly two times better LM latency performance.
• Reduced TCO: Over two times better Total Cost of Ownership for video analytics.
• Reference Board & Dev Kit: Providing developers with tools and resources for edge applications.

Applications include smart cities, factories, healthcare, and robotics. Intel is also accelerating the launch of 18A products for the edge market to align with the PC launch.

Conclusion

Intel is positioned as a leader in the AI computing era, driven by its advancements in process technology, processor architecture, and AI integration. The Core Ultra Series 3 processors, built on the 18A process, represent a significant step forward in performance, efficiency, and AI capabilities. Intel’s commitment to a hybrid AI approach, combined with its strong partnerships with software developers and OEMs, will drive the adoption of AIPC and edge computing solutions across a wide range of industries. The company’s focus on delivering leadership products and scaling its platform will solidify its position as a key enabler of the AI-driven future.